Powering the Future of Semiconductor Innovation.

OSAT · Sanand, Gujarat

Advanced OSAT solutions for AI, power and intelligent electronic systems.

NEXOSAT SEMICON is a diversified OSAT project for the India Semiconductor Mission era — for Sanand GIDC, at the centre of India's fastest-growing semiconductor corridor.

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5 Technology Pillars 12+ Application Verticals Sanand GIDC, Gujarat ISM Aligned Project
5 Technology Pillars 12+ Application Verticals Sanand GIDC, Gujarat ISM Aligned Project

About Company

Building the Future of Semiconductor Innovation

NEXOSAT SEMICON is an emerging semiconductor technology company focused on advanced assembly, packaging, testing, and next-generation integration solutions that enable intelligent electronic systems for global industries.

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About Company

Building the Future of Semiconductor Innovation

NEXOSAT SEMICON is an emerging semiconductor technology company focused on advanced assembly, packaging, testing, and next-generation integration solutions that enable intelligent electronic systems for global industries.

Read more
01

Advanced IC Packaging

Lead-frame (QFN/QFP/SOIC), BGA/LGA, flip-chip, multi-chip and System-in-Package roadmap — the volume base-load of the line.

Planned
02

Power Semiconductor Packaging

IGBT and IGBT modules, Si/SiC MOSFET and GaN HEMT for EV traction, solar/wind inverters, rail, industrial drives and fast chargers.

Roadmap
03

Chiplet & Heterogeneous Integratiosn

2.5D interposer, 3D stacking, TSV / hybrid-bonding readiness, fan-out wafer-level packaging and HBM integration for AI/HPC silicon.

Future
04

Test & Reliability

Wafer sort to final test, burn-in, high-voltage / partial-discharge test for power modules, RF test roadmap, automotive-grade qualification.

Planned
05

AI-Enabled Smart Factory

Deep-learning optical inspection, yield and warpage prediction, closed-loop adaptive test — a founding design principle of the Sanand line.

Roadmap

Why NEXOSAT

India's Semiconductor
Manufacturing Hub

NEXOSAT combines technological innovation, engineering expertise, and a customercentric approach to deliver semiconductor solutions that address the growing complexity of modern electronic systems.

Our strengths include:

  • Advanced semiconductor packaging technologies
  • Strong engineering-driven development
  • Quality-focused manufacturing philosophy
  • Innovation in AI-enabled manufacturing
  • Commitment to reliability and process excellence
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What We Do

NEXOSAT SEMICON focuses on developing comprehensive semiconductor backend manufacturing capabilities across the entire packaging value chain.

Semiconductor Assembly

IC Packaging

Advanced Packaging Technologies

Semiconductor Testing

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Applications

Enabling Innovation Across Industries

NEXOSAT SEMICON develops advanced semiconductor assembly, packaging, testing, and integration solutions that power intelligent electronic systems across diverse industries. Our technologies support high-performance, reliable, and energy-efficient semiconductor devices for emerging and future-ready applications.

Key Applications

AI Accelerators

GPUs & AI Processors

High-Performance Computing Systems

Machine Learning Hardware

AI Servers

Data Centre Infrastructure

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INDUSTRIES WE EMPOWER

Our Technology Focus

NEXOSAT's technology strategy is built around the convergence of semiconductor manufacturing, advanced packaging, artificial intelligence, power electronics, and intelligent system integration.

Advanced IC Packaging System-in-Package (SiP) 2.5D & 3D Chiplet Integration High-Density Packaging Semiconductor Testing & Validation AI-driven Manufacturing Analytics Power Semiconductor Packaging Wide Bandgap Semiconductor Packaging Silicon Photonics Packaging Reliability Engineering
Industries We Enable

Our technologies support semiconductor solutions for diverse industries including

Artificial Intelligence & High-Performance Computing

Automotive Electronics & Electric Vehicles

Renewable Energy & Smart Grid

Industrial Automation & Robotics

5G / 6G Communications

Nexosat Semicon

Why NEXOSAT

NEXOSAT combines technological innovation, engineering expertise, and a customercentric approach to deliver semiconductor solutions that address the growing complexity of modern electronic systems.

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Our strengths include:

Advanced semiconductor packaging technologies.
Strong engineering-driven development.
Quality-focused manufacturing philosophy.
Innovation in AI-enabled manufacturing.
Commitment to reliability and process excellence.
Strategic collaboration with industry and research partners.
Long-term vision toward advanced semiconductor integration technologies.